description the opa2541 is a dual power operational amplifier capable of operation from power supplies up to 40v and output currents of 5a continuous. with two mono- lithic power amplifiers in a single package it provides unequaled functional density. the industry-standard 8-pin to-3 package is isolated from all internal circuitry allowing it to be mounted directly to a heat sink without insulators which de- grade thermal performance. internal circuitry limits output current to approximately 6a. the opa2541 is available in both industrial and military temperature range versions. dual high power operational amplifier features l output currents to 5a l power supplies to 40v l fet input l electrically isolated case applications l motor driver l servo amplifier l syncro/resolver excitation l voice coil driver l bridge amplifier l programmable power supply l audio amplifier opa2541 out
(5, 1) ? s (6) +v s (2) +in
(3, 7) ?n
(4, 8) international airport industrial park ? mailing address: po box 11400 ? tucson, az 85734 ? street address: 6730 s. tucson blvd. ? tucson, az 85706 tel: (520) 746-1111 ? twx: 910-952-1111 ? cable: bbrcorp ? telex: 066-6491 ? fax: (520) 889-1510 ? immediate product info: (800) 548-6132 ? 1987 burr-brown corporation pds-768b printed in u.s.a. october, 1993 sbos157
opa2541 2 the information provided herein is believed to be reliable; however, burr-brown assumes no responsibility for inaccuracies or omissions. burr-brown assumes no responsibility for the use of this information, and all use of such information shall be entirely at the users own risk. prices and specifications are subject to change without notice. no patent rights or licenses to any of the circuits described herein are implied or granted to any third party. burr-brown does not authorize or warrant any burr-brown product for use in life support devices and/or systems. specifications electrical at t c = +25 c and v s = 35vdc, unless otherwise noted. opa2541am opa2541bm, sm parameter conditions min typ max min typ max units input offset voltage v os 2 10 0.25 1mv vs temperature specified temperature range 20 40 15 30 m v/ c vs supply voltage v s = 10v to v max 2.5 10 * * m v/v vs power 20 60 * * m v/w input bias current i b 15 50 * * pa specified temperature range note 1 * input offset current i os 5 30 * * pa specified temperature range note 1 * input characteristics common-mode voltage range specified temperature range (|v s | C6) (|v s | C3) * * v common-mode rejection v cm = (| v s | C6v) 95 106 * * db input capacitance 5*pf input impedance, dc 1*10 12 w gain characteristics open loop gain at 10hz r l = 6 w 90 96 * * db gain-bandwidth product 1.6 * mhz output voltage swing i o = 5a (|v s | C5.5) (|v s | C4.5) * * v i o = 2a (|v s | C4.5) (|v s | C3.6) * * v i o = 0.5a (|v s | C4) (|v s | C3.2) * * v current, continuous +25 c 5 7.0 * * a +85 c 4 5.0 * a +125 c (sm grade only) 3 3.5 a ac performance slew rate 68 ** v/ m s power bandwidth r l = 8 w , v o = 20vrms 45 55 * * khz settling time to 0.1% 2v step 2 * m s capacitive load specified temperature range, g = 1 3.3 * nf specified temperature range, g >10 soa * phase margin specified temperature range, r l = 8 w 40 * degrees channel separation 1khz, r l = 6 w 80 * db power supply power supply voltage, v s specified temperature range 10 30 35 * 35 40 v current, quiescent totalboth amplifiers 40 50 * * ma thermal resistance q jc , (junction-to-case) both amplifiers (2) , ac output f > 60hz 0.8 1.0 * * c/w q jc both amplifiers (2) , dc output 0.9 1.2 * * c/w q jc one amplifier, ac output f > 60hz 1.25 1.5 * * c/w q jc one amplifier, dc output 1.4 1.9 * * c/w q ja , (junction-to-ambient) no heat sink 30 * c/w temperature range case am, bm C25 +85 * * c sm C55 +125 c *specification same as opa2541am. notes: (1) input bias and offset current approximately doubles for every 10 c increase in temperature. (2) assumes equal dissipation in both amplifiers.
opa2541 3 100
10
1
0.1
0.01
0.001 ?5 25 100 125 junction temperature (?) input bias current vs temperature input bias current (na) 05075 typical performance curves t a = +25 c and v s = 35vdc, unless otherwise noted. supply voltage, +v s to Cv s .................................................................. 80v output current ............................................................................. see soa power dissipation, internal (1) ............................................................ 125w input voltage: differential ..................................................................... v s common-mode ............................................................. v s temperature: pin solder, 10s ........................................................ +300 c junction (1) ............................................................... +150 c temperature range: storage .................................................... C65 c to +150 c operating (case) ..................................... C55 c to +125 c note: (1) long term operation at the maximum junction temperature will result in reduced product life. derate internal power dissipation to achieve high mttf. absolute maximum ratings connection diagram 1 2 3 7 8 5 6 a b +v s +in b ?n b out b ? s out a ?n a +in a 4 ordering information package information package drawing model package number (1) opa2541am to-3 030 opa2541bm to-3 030 opa2541sm to-3 030 note: (1) for detailed drawing and dimension table, please see end of data sheet, or appendix d of burr-brown ic data book. top view to-3 model package temperature range opa2541am to-3 C25 c to +85 c opa2541bm to-3 C25 c to +85 c opa2541sm to-3 C55 c to +125 c 1 100 100k 10m frequency (hz) open-loop gain and phase vs frequency 10 1k 10k 1m 110
100
90
80
70
60
50
40
30
20
10
0 voltage gain (db) ?0
0
?5
?0
?35
?80 phase (degrees) z l = 3.3nf phase gain z l = 2k w z l = 3.3nf z l = 2k w
opa2541 4 12
10
8
6
4
2 0 ?0 0 75 125 case temperature (?) output current vs temperature output current (a) ?5 25 50 100 i out i out + 120
110
100
90
80
70
60 50 10 100 100k 1m frequency (hz) common-mode rejection vs frequency cmrr (db) 1k 10k 10
1.0
0.1
0.01 0.001 10 100 10k 100k frequency (hz) total harmonic distortion vs frequency thd + noise (%) 1k p o = 5w p o = 50w p o = 100mw 1k
100
10 1 10 10k 100k frequency (hz) voltage noise density vs frequency voltage noise density (nv/ ? hz) 100 1k 6
5
4
3
2
1
0 03 710 i out (a) output voltage swing vs output current |? s | ?|v out | (v) 145 9 268 |? s | ?|v o | (+v s ) ?v o 1.3
1.2
1.1
1.0
0.9
0.8
0.7 0.6 20 40 70 90 +v s + |? s | (v) normalized quiescent current
vs total power supply voltage normalized i q 30 50 60 80 t c = ?5? t c = +25? t c = +125? typical performance curves (cont) t a = +25 c and v s = 35vdc, unless otherwise noted.
opa2541 5 z load = , v s = ?5v, a v = +1 dynamic response typical performance curves (cont) t a = +25 c and v s = 35vdc, unless otherwise noted. pation (total of both amplifiers) times the appropriate ther- mal resistance d t jc = (p d total) (q jc ). sufficient heat sinking must be provided to keep the case temperature within safe limits for the maximum ambient temperature and power dissipation. the thermal resistance of the heat sink required may be calculated by: q hs = (150 c C d t jc C t a )/p d . commercially available heat sinks usually specify thermal resistance. these ratings are often suspect, however, since they depend greatly on the mounting environment and air flow conditions. actual thermal performance should be verified by measurement of case temperature under the required load and environmental conditions. no insulating hardware is required when using the opa2541. since mica and other similar insulators typically add 0.7 c/w thermal resistance, this is a significant advantage. see burr-brown application note an-83 for further details on heat sinking. safe operating area the safe operating area (soa) curve provides comprehen- sive information on the power handling abilities of the opa2541. it shows the allowable output current as a func- tion of the voltage across the conducting output transistor (see figure 1). this voltage is equal to the power supply voltage minus the output voltage. for example, as the amplifier output swings near the positive power supply voltage, the voltage across the output transistor decreases and the device can safely provide large output currents demanded by the load. installation instructions power supplies the opa2541 is specified for operation from power sup- plies up to 40v. it can also be operated from an unbalanced or a single power supply so long as the total power supply voltage does not exceed 80v (70v for am grade). the power supplies should be bypassed with low series imped- ance capacitors such as ceramic or tantalum. these should be located as near as practical to the amplifiers power supply pins. good power amplifier circuit layout is, in general, like good high-frequency layout. consider the path of large power supply and output currents. avoid routing these connections near low-level input circuitry to avoid waveform distortion and instability. signal dependent load current can modulate the power supply voltage with inadequate power supply bypassing. this can affect both amplifiers outputs. since the second amplifiers signal may not be related to the first, this will degrade the inherent channel separation of the opa2541. heat sinking most applications will require a heat sink to prevent junction temperatures from exceeding the 150 c maximum rating. the type of heat sink required will depend on the output signals, power dissipation of each amplifier, and ambient temperature. the thermal resistance from junction-to-case, q jc , depends on how the power dissipation is distributed on the amplifier die. dc output concentrates the power dissipation in one output transistor. ac output distributes the power dissipation equally between the two output transistors and therefore has lower thermal resistance. similarly, the power dissipation may be all in one amplifier (worst case) or equally distributed between the two amplifiers (best case). thermal resistances are provided for each of these possibilities. the case-to- junction temperature rise is the product of the power dissi- z load = 4700pf, v s = ?5v, a v = +1 dynamic response
opa2541 6 the internal current limit will not provide short-circuit protection in most applications. when the amplifier output is shorted to ground, the full power supply voltage is im- pressed across the conducting output transistor. for in- stance, with v s = 35v, a short circuit to ground would impress 35v across the conducting power transistor. the maximum safe output current at this voltage is 1.8a, so the internal current limit would not protect the amplifier. the unit-to-unit variation and temperature dependence of the internal current limit suggest that it be used to handle abnormal conditions and not activated in commonly encoun- tered circuit operation. reactive, or emf generating loads such as dc motors can present demanding soa requirements. with a purely reac- tive load, output voltage current occurs when the output voltage is zero and the voltage across the conducting transis- tor is equal to the full power supply voltage. see burr- brown application note an-123 for further information on evaluating soa. applications with inductive or emf-generating loads which can produce kick back voltage surges to the amplifiers should include clamp diodes from the output terminals to the power supplies. these diodes should be chosen to limit the peak amplifier output voltage surges to less than 2v beyond the power supply rail voltage. common 1a rated rectifier diodes will suffice in most applications. applications circuits figure 2. clamping output for emf-generating loads. 0.1? 0.1? +35v ?5v a v = 1 + r 2 /r 1 = 5 r 2
10k w r 1
2.5k w v in 30pf 0.5 w v o figure 3. isolating capacitive loads. figure 1. safe operating area. 0.1? l 10? 0.1? 10? +v s + ? s d 1 d 2 inductive-
or emf-
generating
load d 1 ?d 2 : in4003 + figure 4. paralleled operation, extended soa. a v = ? 2 /r 1 = ?0 20pf l 20pf r 2
100k w r 1
10k w 0.1 w 10k w 0.1 w b slave a master v in 10
1.0 0.1 1 100 |v s ?v out | (v) safe operating area |i o | (a) 10 t c = +25? t c = +85? t c = +125? *depending on temperature, maximum output may
be restricted by internal current limit. see output
current specifications and typical curves. *
opa2541 7 0.1? +60v ?v 25k w 0.1? dac80-cbi-i 0-2ma v o 0-50v protects dac
during slewing figure 5. programmable voltage source. figure 6. 16-bit programmable voltage source. 100pf 0.5 w 10k w (1) fb 1
2
3
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16 19 1/2
opa2541 v out = ?0v to +30v 1? + + 1? + lsb msb dac702 ?ma digital word input + 1? + 1? ?5v 20 18 23 +15v 17 21 10k w opa27 2 3 7 4 6 ?5v +15v ?5v 1? + +35v 1? note: (1) tcr tracking resistors. 5k w (1)
opa2541 8 figure 8. limiting output current. figure 7. bridge amplifier motor-speed controller. v in l +v s 750ma continuous ? s note: (1) midwest components inc. 288d01006 (1) 0.1 w 0.6 w 5k w 5k w emf pmi mod907 10k w 10k w 10k w 25k w 25k w 25k w 25k w +15v ?5v 74 13 52 ?5v +35v regulation
adjust v in 1/2
opa2541 1/2
opa2541 ina105kp 6 10k w
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) opa2541am nrnd to-3 lmf 8 18 tbd call ti level-na-na-na opa2541am-bi nrnd zz (bb) zz030 8 tbd call ti call ti opa2541bm nrnd to-3 lmf 8 18 tbd call ti level-na-na-na opa2541sm nrnd to-3 lmf 8 18 tbd call ti level-na-na-na opa2541smq nrnd to-3 lmf 8 1 tbd call ti level-na-na-na (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs) or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 30-mar-2005 addendum-page 1
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security telephony www.ti.com/telephony video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments post office box 655303 dallas, texas 75265 copyright ? 2005, texas instruments incorporated
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